Patent Assignment
Reel/Frame 016193/0969
Assignment of Assignor's Interest
Recorded: 2005-01-25
Pages: 7
Assignors
OSAKA, TETSUYA
Executed: 2004-12-28
KOIWA, ICHIRO
Executed: 2004-12-28
HASHIMOTO, AKIRA
Executed: 2004-12-28
SATO, YOSHIMI
Executed: 2004-12-28
Assignees
WASEDA UNIVERSITY
104, TOTSUKA-MACHI 1-CHOME, SHINJUKU-KU, TOKYO, 169-8050, JAPAN
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, 105-8460, JAPAN
TOKYO OHKA KOGYO CO., LTD.
150 NAKAMARUKO, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, 211-0012, JAPAN
Covered Property
(1)
Thin Film Capacitor, High-Density Packaging Substrate Incorporating Thin Film Capacitor, and Method for Manufacturing Thin-Film Capacitor
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.