IP Library Assignment 016194/0183
Patent Assignment
Reel/Frame 016194/0183

Assignment of Assignor's Interest

Recorded: 2005-01-19 Pages: 2
Assignor
SAKOH, TAKASHI
Executed: 2005-01-12
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMADBE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Fuse Structure for Semiconductor Integrated Circuit with Improved Insulation Film Thckness Uniformity and Moisture Resistance
Patent: 7,323,760 →
Application: 11/037,166 →
Publication: US 2005/0156276
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0975 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →