Patent Assignment
Reel/Frame 025346/0975
Change of Name
Recorded: 2010-11-11
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Semiconductor Substrate and Semiconductor Device Using the Same
Display Controller with Display Memory Circuit
Optical Semiconductor Device
Mos Transistor
Driving Circuit of Current-Driven Device Current-Driven Apparatus, and Method of Driving the Same
Tungsten Metal Removing Solution and Method for Removing Tungsten Metal by Use Thereof
Method for Manufacturing Semiconductor Device
Semiconductor Device Having Multilayer Structure and Method for Manufacturing Thereof
Semiconductor Device and Manufacturing Process Therefor
Display Device, Driver Circuit Therefor, and Method of Driving Same
Semiconductor Integrated Circuit Device
Method for Manufacturing Semiconductor Device
Data Transmission Device and Data Transmission Method
Lead Frame and Semiconductor Device Having the Same as Well as Method of Resin-Molding the Same
Semiconductor Device
Bias circuit for a display driver operational amplifier
Data Output Processor and Method of Manufacturing a Semiconductor Device
Vliw Digital Signal Processor for Achieving Improved Binary Translation
Semiconductor Device Having Bonding Pad Above Low-K Dielectric Film
Semiconductor Device Having a Fuse and a Low Heat Conductive Section for Blowout of Fuse
Semiconductor Device Having an Electrostatic Discharge Protecting Element
Method for Providing Layout Design and Photo Mask
High Frequency Module and Manufacturing Method Thereof
Semiconductor Integrated Circuit and Fabrication Method Thereof
Semiconductor Device and Fabrication Method Thereof
Semiconductor Apparatus Having a Divided Column Region
Charge Pump Circuit with Latch-Up Prevention
Drive Circuit for Display Device
Semiconductor Device Having a Trench Surrounding Each of Plural Unit Cells
Hole Pattern Design Method and Photomask
Semiconductor-Mounted Device and Method for Producing Same
Vco Circuit, Pll Circuit Using Vco Circuit, and Data Recording Apparatus Using the Pll Circuit
Method for Inspecting Mask
Clock Control Method and Circuit
Liquid Crystal Display and Driving Method Thereof
Capacitive Load Driving Circuit and Display Panel Driving Circuit
Semiconductor Device with a Solder Creep-Up Prevention Zone
Current Limiter of Output Transistor
Dynamic Random Access Memory with Silicide Contacts, Cmos Logic Section and Ldd Structure
Method of Manufacturing a Semiconductor Device
Bipolar Transistor Including Divided Emitter Structure
Semiconductor Circuit for Dc-Dc Converter
Integrated Circuit Including an Overvoltage Protection Circuit
Filter Apparatus Including Differential Slave Gm-C Filter with Frequency Characteristics Automatically Tuned by Master Circuit
Integrated Circuit Device with Multiple Chips in One Package
Fuse Structure for Semiconductor Integrated Circuit with Improved Insulation Film Thckness Uniformity and Moisture Resistance
Method of Automatically Correcting Mask Pattern Data and Program for the Same
Integrated Circuit Device
Operational Amplifier Including Low Dc Gain Wideband Feed Forward Circuit and High Dc Gain Narrowband Gain Circuit
Driver Circuit for Light Emitting Element
Method and Apparatus for Diagnosing Fault in Semiconductor Device
Sampling Rate Conversion Method and Apparatus
Chip and Multi-Chip Semiconductor Device Using Thereof and Method for Manufacturing Same
Operational Amplifier Including Low Dc Gain Wideband Circuit and High Dc Gain Narrowband Gain Circuit
Drive Voltage Generator Circuit for Driving Lcd Panel
Semiconductor Integrated Circuit Device Having Memory Macros and Logic Cores on Board
Filter Apparatus Including Slave Gm-C Filter with Frequency Characteristics Automatically Tuned by Master Circuit
Power Supply Circuit
Display Apparatus, and Driving Circuit for the Same
Cmos Reference Voltage Circuit
Semiconductor Device and Manufacturing Method Thereof
Array-Type Computer Processor
Semiconductor Device and Method of Manufacturing a Semiconductor Device
Bias Circuit with Threshold Voltage Change Compensation Function and Temperature Change Compensation Function
Array - Type Computer Processor with Reduced Instruction Storage
Constant Current Source Apparatus Including Two Series Depletion-Type Mos Transistors
Controller Driver and Display Panel Driving Method
Controller Driver, Mobile Terminal Using the Same, and Display Panel Driving Method
Program Tamper Detecting Apparatus, Method for Program Tamper Detection, and Program for Program Tamper Detection
Semiconductor Device with Fuse Wires and Connection Wires
Integrated Circuit Device and Fabrication Method Therefor
Fractional Frequency Divider Circuit and Data Transmission Apparatus Using the Same
Image Memory Architecture for Achieving High Speed Access
Solid-State Imaging Apparatus and Charge Transfer Apparatus
Non-Volatile Memory Element Having Memory Gate and Control Gate Adjacent to Each Other
Method of Manufactoring a Ferroelectric Capacitor Having RU1-Xox Electrode
Semiconductor Device Including P-Channel Type Transistor, and Production Method for Manufacturing Such Semiconductor Device
Low Redundancy Data Ram Architecture for Monolithic Time-Space Switches
Delay Time Verifying Method with Less Processing Load
Nonvolatile Semiconductor Memory Device and Method of Programming in Nonvolatile Semiconductor Memory Device
Overcurrent Protection Circuit and Semiconductor Apparatus
Data Access Controlling Method in Flash Memory and Data Access Controlling Program
Semiconductor Device and Method of Manufacturing the Same
Power Supply Circuit and Display System
Semiconductor Device and Method of Fabricating the Same
Semiconductor Device Package of Stacked Semiconductor Chips with Spacers Provided Therein
Plasma Processing Apparatus, Semiconductor Manufacturing Apparatus and Electrostatic Chucking Unit Used Thereof
A Method, System, and Computer Program for Validating Correspondence Information Between Behavior and Lower Level Description of a Circuit Design.
Semiconductor Device and Manufacturing Process Therefor as Well as Plating Solution
A Serial to Parallel Conversion Circuit Having a Shift Clock Frequency Lower Than a Data Transfer Frequency
Semiconductor Device
Semiconductor Interconnect Structure
Related Assignments
(20)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 1, 2004
From: YAMADA, KOJI
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 016049/0328 →
Assignment of Assignor's Interest
Dec 1, 2004
From: SHIODA, JUNYOU; NOSE, TAKASHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016051/0330 →
Assignment of Assignor's Interest
Dec 1, 2004
From: SHIMODA, MASAMICHI; ABE, KATSUMI; IGUCHI, KOICHI
To: NEC CORPORATION; NEC ELECTRONICS CORPORATION
Reel/Frame 016047/0365 →
Assignment of Assignor's Interest
Dec 2, 2004
From: KIMIZUKA, NAOHIKO; IMAI, KIYOTAKA; MASUOKA, YURI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016051/0335 →
Assignment of Assignor's Interest
Dec 3, 2004
From: MATSUBARA, YOSHIHISA
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 016057/0022 →
Assignment of Assignor's Interest
Dec 3, 2004
From: IZUMI, KATSUYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016053/0664 →
Assignment of Assignor's Interest
Dec 3, 2004
From: HASHIMOTO, YOSHIHARU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016053/0749 →
Assignment of Assignor's Interest
Dec 3, 2004
From: SODA, EIICHI
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 016060/0834 →
Assignment of Assignor's Interest
Dec 6, 2004
From: MINEJI, AKIRA
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 016062/0391 →
Assignment of Assignor's Interest
Dec 6, 2004
From: OKUSHIMA, MOTOTSUGU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016054/0155 →
Assignment of Assignor's Interest
Dec 7, 2004
From: YUSA, KAZUYUKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016065/0099 →
Assignment of Assignor's Interest
Dec 8, 2004
From: OHTO, KOICHI; USAMI, TATSUYA; SASAKI, YOICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016072/0926 →
Assignment of Assignor's Interest
Dec 9, 2004
From: TACHIBANA, HIROAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016071/0256 →
Assignment of Assignor's Interest
Dec 9, 2004
From: SEKO, YOSHIKAZU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016071/0586 →
Assignment of Assignor's Interest
Mar 25, 2005
From: OHTANI, KINYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016400/0580 →
Assignment of Assignor's Interest
Mar 30, 2005
From: SHIMIZU, TOSHIKAZU; WATANABE, KAORI; AOKI, HIDEMITSU
To: KANTO KAGAKU KABUSHIKI KAISHA; NEC ELECTRONICS CORPORATION
Reel/Frame 015969/0829 →
Assignment of Assignor's Interest
May 31, 2005
From: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016075/0892 →
Assignment of Assignor's Interest
Apr 3, 2006
From: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 017407/0502 →
Assignment of Assignor's Interest
Mar 11, 2016
From: KANTO KAGAKU KABUSHIKI KAISHA AND RENESAS ELECTRONIC CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 037954/0322 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →