IP Library › Assignment 016075/0892
Patent Assignment
Reel/Frame 016075/0892

Assignment of Assignor's Interest

Recorded: 2005-05-31 Pages: 4
Assignor
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Properties (7)
Method for Manufacturing a Semiconductor Device and Method for Forming High-Dielectric-Constant Film
Patent: 7,101,753 →
Application: 10/811,979 →
Publication: US 2005/0139937
Method for manufacturing semiconductor device
Application: 10/925,988 →
Publication: US 2005/0048774
Method for Manufacturing Semiconductor Device
Patent: 7,229,915 →
Application: 11/002,198 →
Publication: US 2005/0191850
Method for manufacturing semiconductor device
Application: 11/002,246 →
Publication: US 2005/0153536
Semiconductor Device Having Multilayer Structure and Method for Manufacturing Thereof
Patent: 7,365,431 →
Application: 11/002,269 →
Publication: US 2005/0179134
Method for Manufacturing Semiconductor Device
Patent: 7,259,056 →
Application: 11/003,493 →
Publication: US 2006/0008964
Semiconductor Device Having Bonding Pad Above Low-K Dielectric Film
Patent: 7,148,575 →
Application: 11/009,074 →
Publication: US 2005/0173806
Related Assignments (10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 30, 2004
From: KAMIYAMA, SATOSHI; ARIKADO, TSUNETOSHI
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 015161/0184 →
Assignment of Assignor's Interest Aug 26, 2004
From: KITAJIMA, HIROSHI
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 015739/0906 →
Assignment of Assignor's Interest Dec 3, 2004
From: SODA, EIICHI
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 016056/0898 →
Assignment of Assignor's Interest Dec 3, 2004
From: MATSUBARA, YOSHIHISA
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 016057/0022 →
Assignment of Assignor's Interest Dec 3, 2004
From: SODA, EIICHI
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 016060/0834 →
Assignment of Assignor's Interest Dec 6, 2004
From: MINEJI, AKIRA
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 016062/0391 →
Assignment of Assignor's Interest Dec 13, 2004
From: MATSUBARA, YOSHIHISA
To: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
Reel/Frame 016081/0788 →
Change of Name Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0975 →
Change of Name Dec 22, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025525/0127 →
Change of Address Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →