Patent Assignment
Reel/Frame 016081/0788
Assignment of Assignor's Interest
Recorded: 2004-12-13
Pages: 2
Assignor
MATSUBARA, YOSHIHISA
Executed: 2004-12-06
Assignee
SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
16-1 ONOGAWA, TSUKUBA-SHI, IBARAKI, 305-8569, JAPAN
Covered Property
(1)
Semiconductor Device Having Bonding Pad Above Low-K Dielectric Film
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 31, 2005
From: SEMICONDUCTOR LEADING EDGE TECHNOLOGIES, INC.
To: NEC ELECTRONICS CORPORATION
Reel/Frame 016075/0892 →
Change of Name
Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0975 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →