Delay time verifying method with less processing load
View Patent ↗In a method of verifying a delay time of a target circuit section, a first determination of a shortest of short delay times of each of components of the target circuit section in two or more temperature conditions is carried out. A second determination of a longest one of long delay times of each of the components of the target circuit section in two or more temperature conditions is carried out. Then, a first summation of the shortest delay times of the components is calculated and a second summation of the longest delay times of the components is calculated. Then, whether each of the first and second summations satisfy a predetermined timing constraint is verified.
1. A method of verifying a delay time of a target circuit section including components, comprising:
carrying out a first determination of a shortest one of short delay times of each of said components in two or more temperature conditions;
carrying out a second determination of a longest one of long delay times of each of said components in two or more temperature conditions;
calculating a first summation of said shortest delay times of said components;
calculating a second summation of said longest delay times of said components; and
verifying whether each of said first and second summations satisfy a predetermined timing constraint.
2. The method according to claim 1 , wherein said carrying out a first determination comprises:
referring to a first delay time table to determine said short delay time of each of said components of said target circuit section at a first temperature, said first delay time table indicating said short delay time to a combination of a load capacitor of said component and an input slew thereof at said first temperature; and
referring to a second delay time table to determine said short delay time of each of said components of said target circuit section at a second temperature which is higher than said first temperature, said second delay time table indicating said short delay time to a combination of a load capacitor of said component and an input slew thereof at said second temperature.
3. The method according to claim 2 , wherein said carrying out a second determination comprises:
referring to a third delay time table to determine said long delay time of each of said components of said target circuit section at said first temperature, said third delay time table indicating said long delay time to a combination of a load capacitor of said component and an input slew thereof at said first temperature; and
referring to a fourth delay time table to determine said long delay time of each of said components of said target circuit section at said second temperature which is higher than said first temperature, said fourth delay time table indicating said long delay time to a combination of a load capacitor of said component and an input slew thereof at said second temperature.
4. The method according to claim 3 , wherein said first temperature is a lowest temperature within an operation guarantee range, and said second temperature is a highest temperature within an operation guarantee range.
5. The method according to claim 1 , wherein said carrying out a first determination comprises:
referring to a fifth delay time table to determine said short delay time of each of said components of said target circuit section, said fifth delay time table indicating the shortest one of said short delay times at first and second temperatures to a combination of a load capacitor of said component and an input slew thereof.
6. The method according to claim 5 , wherein said carrying out a second determination comprises:
referring to a sixth delay time table to determine said long delay time of each of said components of said target circuit section, said sixth delay time table indicating the longest one of said long delay times at said first and second temperatures to a combination of a load capacitor of said component and an input slew thereof.
7. The method according to claim 6 , wherein said first temperature is a lowest temperature within an operation guarantee range, and said second temperature is a highest temperature within an operation guarantee range.