Patent Assignment
Reel/Frame 016223/0497
Assignment of Assignor's Interest
Recorded: 2005-01-25
Pages: 2
Assignee
VIA TECHNOLOGIES, INC.
8F, 535, CHUNG-CHENG RD., HSIN-TIEN, TAIPEI, R.O.C., TAIWAN
Covered Property
(1)
Module Board Having Embedded Chips and Components and Method of Forming the Same