Patent Assignment
Reel/Frame 016223/0551
Assignment of Assignor's Interest
Recorded: 2005-01-25
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Ic Chip Package Structure and Underfill Process