Patent Assignment
Reel/Frame 016231/0353
Assignment of Assignor's Interest
Recorded: 2005-01-28
Pages: 2
Assignors
TAKAI, KENJI
Executed: 2005-01-24
MORIIKE, NORIO
Executed: 2005-01-24
KAMIYAMA, KENICHI
Executed: 2005-01-24
WATANABE, TAKAKO
Executed: 2005-01-24
TAKANEZAWA, SHIN
Executed: 2005-01-24
MORITA, KOJI
Executed: 2005-01-24
MASUDA, KATSUYUKI
Executed: 2005-01-24
HASEGAWA, KIYOSHI
Executed: 2005-01-24
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Adhesion Assisting Agent-Bearing Metal Foil, Printed Wiring Board, and Production Method of Printed Wiring Board
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →