Patent Assignment
Reel/Frame 016232/0903
Assignment of Assignor's Interest
Recorded: 2004-03-02
Pages: 2
Assignor
OGAWA, TSUYOSHI
Executed: 2003-12-16
Assignee
SONY CORPORATION
7-35 KITASHINAGAWA, 6-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Multi-Layer Interconnection Circuit Module and Manufacturing Method Thereof