Patent Assignment
Reel/Frame 016242/0008
Assignment of Assignor's Interest
Recorded: 2005-02-03
Pages: 3
Assignor
KIM, HYEONG-SEOB
Executed: 2005-01-18
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including a Semiconductor Device, and Method of Manufacturing the Same