Patent Assignment
Reel/Frame 016242/0823
Assignment of Assignor's Interest
Recorded: 2005-02-03
Pages: 3
Assignor
DESHI, TAN
Executed: 2005-02-02
Assignee
LASERFACTURING INC.
479 PINEDALE AVENUE, BURLINGTON, ONTARIO, L7L 3W3, CANADA
Covered Property
(1)
Method and Apparatus for Dicing of Thin and Ultra Thin Semiconductor Wafer Using Ultrafast Pulse Laser