Patent Assignment
Reel/Frame 016258/0940
Assignment of Assignor's Interest
Recorded: 2005-02-10
Pages: 3
Assignor
MIYAZAWA, MAKOTO
Executed: 2004-10-27
Assignee
SIEKO EPSON CORPORATION
4-1, NISHI-SHIJUKU 2-CHOME, SHINJUKU-KU, TOKYO, JAPAN
Covered Property
(1)
Aspherical Surface Processing Method, Aspherical Surface Forming Method and Aspherical Surface Processing Apparatus
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.