Patent Assignment
Reel/Frame 016266/0639
Assignment of Assignor's Interest
Recorded: 2004-07-01
Pages: 3
Assignors
ARUGA, HIROSHI
Executed: 2004-05-11
TAKAGI, SHINICHI
Executed: 2004-05-11
SAKAI, HIYOHIDE
Executed: 2004-05-11
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property
(1)
Feed Through Structure for Optical Semiconductor Package