Patent Assignment
Reel/Frame 016316/0076
Assignment of Assignor's Interest
Recorded: 2005-03-02
Pages: 3
Assignors
HWANG, SEONG-YONG
Executed: 2005-01-26
OH, WEOK-SIK
Executed: 2005-01-26
YOON, JU-YOUNG
Executed: 2005-01-26
CHOI, SUNG-LAK
Executed: 2005-01-26
SONG, CHUN-HO
Executed: 2005-01-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 442-742, KOREA, REPUBLIC OF
Covered Property
(1)
Anisotropic Conductive Film and Bump, and Packaging Structure of Semiconductor Having the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.