Patent Assignment
Reel/Frame 016322/0430
Assignment of Assignor's Interest
Recorded: 2005-03-03
Pages: 2
Assignors
WEI, JUN
Executed: 2005-01-17
WANG, ZHIPING
Executed: 2004-12-24
XIE, HONG
Executed: 2005-01-17
Assignee
AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
20 BIOPOLIS WAY #07-01 CENTROS, SINGAPORE, 138668, SINGAPORE
Covered Property
(1)
Method of Wafer/Substrate Bonding