IP Library › Assignment 016350/0626
Patent Assignment
Reel/Frame 016350/0626

Assignment of Assignor's Interest

Recorded: 2005-03-03 Pages: 3
Assignors
FUKUDA, TOSHIYUKI
Executed: 2005-02-21
MINAMIO, MASANORI
Executed: 2005-02-21
FUJIMOTO, HIROAKI
Executed: 2005-02-21
SAHARA, RYUICHI
Executed: 2005-02-21
ITOU, KENICHI
Executed: 2005-02-21
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property (1)
Resin-Encapsulated Semiconductor Device and Lead Frame, and Method for Manufacturing the Same
Patent: 7,495,319 →
Application: 11/071,343 →
Publication: US 2005/0194676
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 3, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021779/0851 →
Assignment of Assignor's Interest Apr 20, 2017
From: PANASONIC CORPORATION
To: III HOLDINGS 12, LLC
Reel/Frame 042296/0246 →