Patent Assignment
Reel/Frame 042296/0246
Assignment of Assignor's Interest
Recorded: 2017-04-20
Pages: 19
Assignor
PANASONIC CORPORATION
Executed: 2017-03-24
Assignee
III HOLDINGS 12, LLC
2711 CENTERVILLE ROAD, SUITE 400, WILMINGTON, DELAWARE, 19808
Covered Properties
(46)
A Leadframe for a Semiconductor Device Having Leads with Land Electodes
Patent:
6,642,609 →
Application:
09/654,070 →
Cooling Element and Cooling Apparatus Using the Same
Patent:
6,543,521 →
Application:
09/678,794 →
Semiconductor Device and Method for the Fabrication Thereof
Efficient, Precise Rf Modulation Using Multiple Amplifier Stages
High Quality Power Ramping in a Communications Transmitter
Method and Apparatus for Impedance Matching in an Amplifier Using Lumped and Distributed Inductance
Leadframe, Resin-Molded Semiconductor Device Including the Leadframe, Method of Making the Leadframe and Method for Manufacturing the Device
Leadframe and Method for Manufacturing Resin-Molded Semiconductor Device
Switch Mode Power Supply and Driving Method for Efficient Rf Amplification
Differential Rf/Microwave Power Amplifier Using Independent Synchronized Polar Modulators
Combined Low-If/Direct Down Conversion Baseband Architecture for 3G Gsm/Wcdma Receivers
Resin-Encapsulated Semiconductor Device and Method for Manufacturing the Same
Lead Frame
Single-Instruction Multiple-Data (Simd)-Based Algorithms for Processing Video Data
Method and Apparatus for Combining Two Ac Waveforms
Semiconductor Module
A Resin-Molded Semiconductor Device
Digital Time Alignment in a Polar Modulator
Transmission Device and Delay Time Adjustment Method Thereof
Home Agent, Mobile Router, and Mobile Communication Method Using the Same
Finfet-Type Semiconductor Device and Method for Fabricating the Same
Power Supply Wiring Method for Semiconductor Integrated Circuit and Semiconductor Integrated Circuit
Leadframe, Resin-Molded Semiconductor Device Including the Leadframe, Method of Making the Leadframe and Method for Manufacturing the Device
Semiconductor Device and Method for the Fabrication Thereof Grinding Frame Portion Such That Plural Electrode Constituent Portions
Resin-Encapsulated Semiconductor Device and Lead Frame, and Method for Manufacturing the Same
High-Quality Power Ramping in a Communications Transmitter
Method and Apparatus for Impedance Matching in an Amplifier Using Lumped and Distributed Inductance
Semiconductor Integrated Circuit Having Improved Power Supply Wiring
Apparatus and Method for Multi-Phase Digital Sampling
Semiconductor Device and Method for the Fabrication Thereof Including Grinding a Major Portion of the Frame
Combined Low-If/Direct Down Conversion Baseband Architecture for 3G Gsm/Wcdma Receivers
Processor Capable of Reconfiguring a Logical Circuit
Semiconductor Leakage Current Detector and Leakage Current Measurement Method, Semiconductor Leakage Current Detector with Voltage Trimming Function and Reference Voltage Trimming Method, and Semiconductor Intergrated Circuit Thereof
Transmission Circuit and Communication Apparatus Employing the Same
Power Control for a Plurality of Internal Power Supply Circuits of a Semiconductor Integrated Circuit
Envelope Modulator Saturation Detection Using a Dc-Dc Converter
Patent:
7,702,300 →
Application:
11/827,859 →
Enabling Higher Operation Speed and/or Lower Power Consumption in a Semiconductor Integrated Circuit Device
Data Processing Device
Transmission Apparatus and Communication Apparatus
Multi Thread Processor Having Dynamic Reconfiguration Logic Circuit
Semiconductor Integrated Circuit Having Improved Power Supply Wiring
Phase Lock Loop with a Multiphase Oscillator
Memory Access Control Device, Integrated Circuit, Memory Access Control Method, and Data Processing Device
Semiconductor Device and Method for Fabricating the Same
Power Supply Interconnect Structure of Semiconductor Integrated Circuit
Stacked Semiconductor Device with Through Via
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Mar 21, 2017
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 042044/0745 →
Assignment of Assignor's Interest
Apr 28, 2017
From: TROPIAN, INC
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 042181/0623 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 018014 Frame: 0309. Assignor(S) Hereby Confirms the Assignment.
May 26, 2017
From: TROPIAN, INC.
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 042588/0539 →
Corrective Assignment to Correct the Nature of Conveyance from Assignment to Merger Previously Recorded at Reel: 011855 Frame: 0674. Assignor(S) Hereby Confirms the Merger.
May 30, 2017
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 043013/0934 →
Corrective Assignment to Correct the to Add Previously Omitted Exhibits to Asset Purchase Agreement Previously Recorded on Reel 018350 Frame 0397. Assignor(S) Hereby Confirms the Asset Purchase Agreement.
Jun 1, 2017
From: TROPIAN, INC.
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 042681/0178 →
Assignment of Assignor's Interest
Jun 16, 2017
From: TROPIAN, INC.
To: PANASONIC CORPORATION
Reel/Frame 042733/0728 →