Patent Assignment
Reel/Frame 042044/0745
Change of Name
Recorded: 2017-03-21
Pages: 5
Assignor
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Executed: 2008-10-01
Assignee
PANASONIC CORPORATION
1006, OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Properties
(29)
Sound Reproducing Speed Converter
Patent:
6,115,687 →
Application:
09/091,823 →
A Leadframe for a Semiconductor Device Having Leads with Land Electodes
Patent:
6,642,609 →
Application:
09/654,070 →
Excitation Vector Generatng Apparatus and Speech Coding/ Decoding Apparatus.
Patent:
6,928,406 →
Application:
09/674,442 →
Cooling Element and Cooling Apparatus Using the Same
Patent:
6,543,521 →
Application:
09/678,794 →
Semiconductor Device and Method for the Fabrication Thereof
Efficient, Precise Rf Modulation Using Multiple Amplifier Stages
High Quality Power Ramping in a Communications Transmitter
Method and Apparatus for Impedance Matching in an Amplifier Using Lumped and Distributed Inductance
Leadframe, Resin-Molded Semiconductor Device Including the Leadframe, Method of Making the Leadframe and Method for Manufacturing the Device
Leadframe and Method for Manufacturing Resin-Molded Semiconductor Device
Switch Mode Power Supply and Driving Method for Efficient Rf Amplification
Differential Rf/Microwave Power Amplifier Using Independent Synchronized Polar Modulators
Combined Low-If/Direct Down Conversion Baseband Architecture for 3G Gsm/Wcdma Receivers
Resin-Encapsulated Semiconductor Device and Method for Manufacturing the Same
Lead Frame
Single-Instruction Multiple-Data (Simd)-Based Algorithms for Processing Video Data
Method and Apparatus for Combining Two Ac Waveforms
Semiconductor Module
A Resin-Molded Semiconductor Device
Digital Time Alignment in a Polar Modulator
Transmission Device and Delay Time Adjustment Method Thereof
Power Supply Wiring Method for Semiconductor Integrated Circuit and Semiconductor Integrated Circuit
Leadframe, Resin-Molded Semiconductor Device Including the Leadframe, Method of Making the Leadframe and Method for Manufacturing the Device
Semiconductor Device and Method for the Fabrication Thereof Grinding Frame Portion Such That Plural Electrode Constituent Portions
High-Quality Power Ramping in a Communications Transmitter
Method and Apparatus for Impedance Matching in an Amplifier Using Lumped and Distributed Inductance
Semiconductor Device and Method for the Fabrication Thereof Including Grinding a Major Portion of the Frame
Combined Low-If/Direct Down Conversion Baseband Architecture for 3G Gsm/Wcdma Receivers
Semiconductor Leakage Current Detector and Leakage Current Measurement Method, Semiconductor Leakage Current Detector with Voltage Trimming Function and Reference Voltage Trimming Method, and Semiconductor Intergrated Circuit Thereof
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 20, 2017
From: PANASONIC CORPORATION
To: III HOLDINGS 12, LLC
Reel/Frame 042296/0246 →
Assignment of Assignor's Interest
May 2, 2017
From: PANASONIC CORPORATION
To: III HOLDINGS 12, LLC
Reel/Frame 042386/0188 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 018014 Frame: 0309. Assignor(S) Hereby Confirms the Assignment.
May 26, 2017
From: TROPIAN, INC.
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 042588/0539 →
Corrective Assignment to Correct the Nature of Conveyance from Assignment to Merger Previously Recorded at Reel: 011855 Frame: 0674. Assignor(S) Hereby Confirms the Merger.
May 30, 2017
From: MATSUSHITA ELECTRONICS CORPORATION
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 043013/0934 →