IP Library › Granted Patent US 6,638,790
Granted Patent Utility
US 6,638,790 · Confirmation No. 4515

LEADFRAME AND METHOD FOR MANUFACTURING RESIN-MOLDED SEMICONDUCTOR DEVICE

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2017-11-01 C.AD.PAIR Change of Address via Patent Application Information Retrieval (PAIR) 1 View
2017-11-01 C.AD.PAIR Change of Address via Patent Application Information Retrieval (PAIR) 1 View
2017-09-20 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-09-20 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2017-07-18 PA.. Power of Attorney 2 View
2017-07-18 R3.73 Assignee showing of ownership per 37 CFR 3.73 2 View
2017-07-18 N417 Electronic Filing System Acknowledgment Receipt 2 View
2003-08-14 IFEE Issue Fee Payment (PTO-85B) 1 View
2001-11-06 TRNA Transmittal of New Application 2 View
2001-11-06 ADS Application Data Sheet 1 View
2001-11-06 SPEC Specification 41 View
2001-11-06 CLM Claims 2 View
2001-11-06 ABST Abstract 1 View
2001-11-06 DRW Drawings-only black and white line drawings 13 View
2001-11-06 OATH Oath or Declaration filed 3 View
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Quick Facts
Patent No.
US 6,638,790
App. No.
09/985,883
Filed
2001-11-06
Granted
2003-10-28
Pub. No.
US20020031869A1
Examiner
TRINH, HOA B
Art Unit
2814
PTA
0 days