IP Library › Granted Patent US 6,720,207
Granted Patent Utility
US 6,720,207 · Confirmation No. 3061

LEADFRAME, RESIN-MOLDED SEMICONDUCTOR DEVICE INCLUDING THE LEADFRAME, METHOD OF MAKING THE LEADFRAME AND METHOD FOR MANUFACTURING THE DEVICE

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Quick Facts
Patent No.
US 6,720,207
App. No.
09/971,731
Filed
2001-10-09
Granted
2004-04-13
Pub. No.
US20020109214A1
Examiner
THAI, DAVIS
Art Unit
2827
PTA
-4 days