IP Library › Assignment 012233/0752
Patent Assignment
Reel/Frame 012233/0752

Assignment of Assignor's Interest

Recorded: 2001-10-09 Pages: 3
Assignors
MINAMIO, MASANORI
Executed: 2001-10-02
OHIRO, MASAHIKO
Executed: 2001-10-02
SATOH, YOSHINORI
Executed: 2001-10-02
FUKUDA, TOSHIYUKI
Executed: 2001-10-02
KAWAI, FUMIHIKO
Executed: 2001-10-02
KOICHI, MASANORI
Executed: 2001-10-02
OGA, AKIRA
Executed: 2001-10-02
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA, KADOMA-SHI, OSAKA 571-8501, JAPAN
Covered Property (1)
Leadframe, Resin-Molded Semiconductor Device Including the Leadframe, Method of Making the Leadframe and Method for Manufacturing the Device
Patent: 6,720,207 →
Application: 09/971,731 →
Publication: US 2002/0109214
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 21, 2017
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 042044/0745 →
Assignment of Assignor's Interest Apr 20, 2017
From: PANASONIC CORPORATION
To: III HOLDINGS 12, LLC
Reel/Frame 042296/0246 →