Stacked semiconductor device with through via

1. A semiconductor device comprising:

a semiconductor substrate including a first surface, which has an active element thereon, and a second surface opposite to the first surface;

a through-via penetrating the semiconductor substrate; and

an interlayer insulating film disposed on the first surface and the active element,

wherein the through-via has a stacked structure of a first conductive film formed in a portion of the semiconductor substrate closer to the first surface, and a second conductive film formed in a portion of the semiconductor substrate closer to the second surface,

the through-via has a minimum diameter between the first and second surfaces of the semiconductor substrate,

an insulating layer is buried inside the semiconductor substrate, and

the first conductive film is electrically connected to the second conductive film in the insulating layer.

2. The semiconductor device of claim 1 , wherein

the first conductive film is buried in a first hole formed in a portion of the semiconductor substrate closer to the first surface,

the second conductive film is buried in a second hole formed in a portion of the semiconductor substrate closer to the second surface, and

the first hole is connected to the second hole, and the first conductive film is electrically connected to the second conductive film, thereby forming the through-via.

3. The semiconductor device of claim 2 , wherein an opening size of the second hole at a connecting portion with the first hole is greater than an opening size of the first hole at a connecting portion with the second hole.

4. The semiconductor device of claim 3 , wherein the first hole has a greater depth than the second hole.

5. The semiconductor device of claim 2 , wherein an opening size of the second hole at the second surface is greater than an opening size of the first hole at the first surface.

6. The semiconductor device of claim 1 , wherein the insulating layer is discontinuously formed along a principal surface of the semiconductor substrate.

7. The semiconductor device of claim 1 , wherein

a first insulating via coating film is formed between the first conductive film and the semiconductor substrate, and

a second insulating via coating film is formed between the second conductive film and the semiconductor substrate.

8. A stacked semiconductor device formed by stacking a first semiconductor device including a logic circuit and a second semiconductor device including a solid-state image sensor,

wherein at least one of the first semiconductor device or the second semiconductor device is the semiconductor device of claim 1 .

9. The stacked semiconductor device of claim 8 , wherein the second semiconductor device is stacked on the first semiconductor device.

10. A stacked semiconductor device formed by stacking a first semiconductor device, a second semiconductor device, and a third semiconductor device,

wherein the second semiconductor device is stacked on a first region of the first semiconductor device,

the third semiconductor device is stacked on a second region of the first semiconductor device, and

at least one of the first semiconductor device, the second semiconductor device, or the third semiconductor device is the semiconductor device of claim 1 .

11. The stacked semiconductor device of claim 10 , wherein the first semiconductor device, the second semiconductor device, and the third semiconductor device have different functions.

12. The stacked semiconductor device of claim 10 , wherein a top of the second semiconductor device is located at a substantially same height as a top of the third semiconductor device.

13. The stacked semiconductor device of claim 10 , wherein the first semiconductor device includes a logic circuit.

14. The stacked semiconductor device of claim 10 , wherein the second semiconductor device includes a memory element.

15. The stacked semiconductor device of claim 10 , wherein the third semiconductor device includes a solid-state image sensor.

16. A manufacturing method of a semiconductor device comprising the steps of:

forming a first hole in a semiconductor substrate from a first surface of the semiconductor substrate including the first surface and a second surface opposite to the first surface;

forming a first conductive film in the first hole;

forming an active element on the first surface, after forming the first conductive film;

forming an interlayer insulating film on the first surface and the active element;

forming a second hole connected to the first hole in the semiconductor substrate from the second surface of the semiconductor substrate, after forming the interlayer insulating film; and

forming in the second hole, a second conductive film to be electrically connected to the first conductive film, thereby forming a through-via, wherein

an insulating layer is buried inside the semiconductor substrate, and

the first conductive film is electrically connected to the second conductive film in the insulating layer.

17. The method of claim 16 , wherein the insulating layer is formed by SIMOX.

18. The method of claim 16 , wherein the insulating layer is discontinuously formed along a principal surface of the semiconductor substrate.

19. The method of claim 16 , wherein

in the step of forming a second hole, the semiconductor substrate is etched from the second surface using the insulating layer as an etching stopper to form the second hole.

20. The method of claim 16 , wherein an opening size of the second hole at a connecting portion with the first hole is greater than an opening size of the first hole at a connecting portion with the second hole.

21. The method of claim 16 , wherein an opening size of the second hole at the second surface is greater than an opening size of the first hole at the first surface.