Patent Assignment
Reel/Frame 016365/0390
Assignment of Assignor's Interest
Recorded: 2005-03-07
Pages: 3
Assignee
SEIKO EPSON CORPORATION
4-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU, TOKYO, JAPAN
Covered Property
(1)
Thin Film Device Supply Body, Method of Fabricating Thin Film Device, Method of Transfer, Method of Fabricating Semiconductor Device, and Electronic Equipment
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.