IP Library › Assignment 016368/0732

Patent Assignment

Reel/Frame 016368/0732

Assignment of Assignor's Interest

Recorded: 2005-06-20 Pages: 4

View PDF Order Certified Copy

Assignors

JOHN, JOACHIM

Executed: 2005-05-23

ZIMMERMANN, LARZ

Executed: 2005-06-02

Assignee

INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)

KAPELDREEF 75, 3001 LEUVEN, BELGIUM

Covered Property (1)

Method for Depositing a Solder Material on a Substrate

Patent: 8,227,331 →

Application: 11/069,219 →

Publication: US 2005/0227413

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.

Corrective Assignment to Correct the Last Name of the Second Assignor Previously Recorded at Reel 016368 Frame 0732 Aug 23, 2005

From: JOHN, JOACHIM; ZIMMERMANN, LARS

To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)

Reel/Frame 016661/0952 →

"Imec" Is an Alternative Official Name for "Interuniversitair Microelektronica Centrum Vzw" Apr 7, 2010

From: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW

Reel/Frame 024200/0675 →