IP Library › Assignment 016661/0952
Patent Assignment
Reel/Frame 016661/0952

Corrective Assignment to Correct the Last Name of the Second Assignor Previously Recorded at Reel 016368 Frame 0732

Recorded: 2005-08-23 Pages: 5
Assignors
JOHN, JOACHIM
Executed: 2005-05-23
ZIMMERMANN, LARS
Executed: 2005-06-02
Assignee
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
KAPELDREEF 75, 3001 LEUVEN, BELGIUM
Covered Property (1)
Method for Depositing a Solder Material on a Substrate
Patent: 8,227,331 →
Application: 11/069,219 →
Publication: US 2005/0227413
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 20, 2005
From: JOHN, JOACHIM; ZIMMERMANN, LARZ
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
Reel/Frame 016368/0732 →
"Imec" Is an Alternative Official Name for "Interuniversitair Microelektronica Centrum Vzw" Apr 7, 2010
From: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW
To: IMEC
Reel/Frame 024200/0675 →