Patent Assignment
Reel/Frame 016373/0401
Assignment of Assignor's Interest
Recorded: 2005-03-08
Pages: 4
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
NO. 8. LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Method for Forming Dual Damascene with Improved Etch Profiles