Patent Assignment
Reel/Frame 016384/0673
Assignment of Assignor's Interest
Recorded: 2005-06-22
Pages: 3
Assignors
KONG, YUNG-CHEOL
Executed: 2005-04-04
SEO, BYOUNG-RIM
Executed: 2005-04-04
DO, JAE-CHEON
Executed: 2005-04-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Image Sensor Module Structure Comprising Wire Bonding Package and Method of Manufacturing the Image Sensor Module Structure