Patent Assignment
Reel/Frame 016412/0305
Assignment of Assignor's Interest
Recorded: 2005-03-23
Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2005-03-14
CHOU, CHIU-MING
Executed: 2005-03-14
CHOU, CHIEN-KANG
Executed: 2005-03-14
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property
(1)
Very Thick Metal Interconnection Scheme in Ic Chips
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 3, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017566/0028 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →