Patent Assignment
Reel/Frame 016462/0222
Assignment of Assignor's Interest
Recorded: 2005-04-18
Pages: 3
Assignor
HSIEH, CHIA-MING
Executed: 2005-03-22
Assignee
BENQ CORPORATION
NO. 157, SHAN-YING ROAD, KWEI-SHAN HSIANG, TAO-YUAN HSIEN, TAIWAN
Covered Property
(1)
Ball Grid Array Package with an Electromagnetic Shield Connected Directly to a Printed Circuit Board