Patent Assignment
Reel/Frame 016483/0779
Assignment of Assignor's Interest
Recorded: 2005-04-22
Pages: 4
Assignors
SUTOH, MANABU
Executed: 2005-01-11
USHIO, YOSHITO
Executed: 2005-01-17
FUJISAWA, TOYOHIKO
Executed: 2005-01-17
MINE, KATSUTOSHI
Executed: 2005-01-19
Assignee
DOW CORNING TORAY SILICONE COMPANY, LTD.
4TH FLOOR, AIG BUILDING, 1-3, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO 100-0005, JAPAN
Covered Property
(1)
Silicone-Based Adhesive Sheet, Method of Bonding a Semiconductor Chip to a Chip Attachment Component, and a Semiconductor Device