Patent Assignment
Reel/Frame 016503/0197
Assignment of Assignor's Interest
Recorded: 2005-04-25
Pages: 3
Assignors
SASAGAWA, SHINYA
Executed: 2005-04-06
OKAMOTO, SATORU
Executed: 2005-04-06
MONOE, SHIGEHARU
Executed: 2005-04-08
Assignee
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
398, HASE, ATSUGI-SHI, KANAGAWA-KEN, 243-0036, JAPAN
Covered Property
(1)
Method for Manufacturing a Wiring Over a Substrate