Patent Assignment
Reel/Frame 016505/0108
Assignment of Assignor's Interest
Recorded: 2005-04-21
Pages: 3
Assignors
SAND, KIRBY
Executed: 2005-04-19
HALUZAK, CHARLES C.
Executed: 2005-04-19
CHEN, CHIEN-HUA
Executed: 2005-04-19
Assignee
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
20555 SH 249, HOUSTON, TEXAS, 77070
Covered Property
(1)
Bonding Interface for Micro-Device Packaging