Patent Assignment
Reel/Frame 016508/0315
Assignment of Assignor's Interest
Recorded: 2005-09-08
Pages: 3
Assignors
AONUMA, HIDENORI
Executed: 2005-08-17
OHSAWA, TETSUYA
Executed: 2005-08-17
OHWAKI, YASUHITO
Executed: 2005-08-17
Assignee
NITTO DENKO CORPORATION
1-2, SHIMOHOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Partially Completed Wiring Circuit Board Assembly Sheet and Production Method of Wiring Circuit Board Using Said Sheet