IP Library › Assignment 016512/0001
Patent Assignment
Reel/Frame 016512/0001

Assignment of Assignor's Interest

Recorded: 2005-05-02 Pages: 3
Assignor
BENDER, DAVID L.
Executed: 2005-04-25
Assignee
SOLAICX, INC.
5102 CALLE DEL SOL, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Method and Apparatus for Cutting Ultra Thin Silicon Wafers
Patent: 7,025,665 →
Application: 11/089,725 →
Publication: US 2005/0217656
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Grant of Patent Security Interest Dec 10, 2009
From: SOLAICX
To: LAMINAR DIRECT CAPITAL L.L.C., AS COLLATERAL AGENT
Reel/Frame 023627/0903 →
Release of Security Interest Mar 23, 2011
From: LAMINAR DIRECT CAPITAL, L.L.C.
To: SOLIACX
Reel/Frame 026003/0454 →
Release of Security Interest Mar 31, 2011
From: LAMINAR DIRECT CAPITAL, L.L.C.
To: SOLAICX
Reel/Frame 026053/0355 →
Release of Security Interest Feb 28, 2014
From: LAMINAR DIRECT CAPITAL, L.L.C.
To: SOLAICX
Reel/Frame 032327/0693 →