IP Library › Assignment 023627/0903
Patent Assignment
Reel/Frame 023627/0903

Grant of Patent Security Interest

Recorded: 2009-12-10 Pages: 7
Assignor
SOLAICX
Executed: 2009-06-16
Assignee
LAMINAR DIRECT CAPITAL L.L.C., AS COLLATERAL AGENT
20400 STEVENS CREEK BOULEVARD, SUITE 850, CUPERTINO, CALIFORNIA, 95014
Covered Properties (9)
High Reflectivity Atmospheric Pressure Furnace for Preventing Contamination of a Work Piece
System for Continuous Growing of Monocrystalline Silicon
Method and Apparatus for Cutting Ultra Silicon Wafers
System for Continuous Growing of Monocrystalline Silicon
Patent: 7,635,414 →
Application: 10/789,638 →
Publication: US 2005/0092236
Formation of a Silicon Sheet by Cold Surface Casting
Patent: 7,294,197 →
Application: 10/918,681 →
Method and Apparatus for Cutting Ultra Thin Silicon Wafers
Patent: 7,025,665 →
Application: 11/089,725 →
Publication: US 2005/0217656
Weir design providing optimal purge gas flow, melt control, and temperature stabilization for improved single crystal growth in a continuous Czochralski process
Application: 60/906,945 →
Method and apparatus for controlling melt temperature in a czochralski grower
Application: 61/005,384 →
Crucible weight measurement system for controlling feedstock introduction in czochralski crystal growth
Application: 61/005,426 →
Related Assignments (14)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest Mar 23, 2011
From: LAMINAR DIRECT CAPITAL, L.L.C.
To: SOLIACX
Reel/Frame 026003/0454 →
Security Agreement Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
Release of Security Interest Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
Release of Security Interest Dec 26, 2013
From: BANK OF AMERICA, N.A.
To: ENFLEX CORPORATION; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0031 →
Security Agreement Jan 30, 2014
From: SUNEDISON, INC.; SOLAICX; SUN EDISON, LLC; NVT, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH
Reel/Frame 032177/0359 →
Security Agreement Feb 28, 2014
From: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX; NVT, LLC
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 032372/0610 →
Release of Security Interest Feb 28, 2014
From: LAMINAR DIRECT CAPITAL, L.L.C.
To: SOLAICX
Reel/Frame 032327/0693 →
Release of Security Interest Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
Security Interest Aug 11, 2015
From: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX; NVT, LLC
To: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
Reel/Frame 036329/0470 →
Change of Name Jan 4, 2016
From: SOLAICX, INC.
To: SOLAICX
Reel/Frame 037415/0872 →
Release of Security Interest Jan 13, 2016
From: GOLDMAN SACHS BANK USA, AS ADMINISTRATIVE AGENT
To: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX; NVT, LLC
Reel/Frame 037508/0884 →
Security Interest Jan 13, 2016
From: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX; NVT, LLC
To: WILMINGTON TRUST, NATIONAL ASSOCIATION, SOLELY IN ITS CAPACITY AS COLLATERAL TRUSTEE
Reel/Frame 037508/0606 →
Patent Security Agreement Apr 28, 2016
From: SOLAICX
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS ADMINISTRATIVE AGENT
Reel/Frame 038556/0677 →
Assignment of Assignor's Interest Apr 27, 2017
From: SUNEDISON, INC.; SUNEDISON PRODUCTS SINGAPORE PTE. LTD.; MEMC PASADENA, INC.; SOLAICX
To: CORNER STAR LIMITED
Reel/Frame 042351/0659 →