IP Library Granted Patent US 7,294,197
Granted Patent B1
US 7,294,197 · App. 10/918,681 · Granted Nov 13, 2007

Formation of a silicon sheet by cold surface casting

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Quick Facts
Patent No.
US 7,294,197
App. No.
10/918,681
Granted
Nov 13, 2007
Kind
B1
Abstract

Metallurgical grade silicon or high purity silicon beads developed from a fluidized bed process are melted in a cooled aluminum crucible, such that a non wetted interface is created between the molten silicon and a cooled supporting substrate that includes a surface layer of substantially inert aluminum oxide. It is believed that the molten silicon does not wet the surface of the supporting substrate and the surface of the supporting substrate does not chemically interact with the silicon. It is shown that, in spite of the enormous temperature difference, molten silicon (ca. 1450° C.) can be stabilized, by appropriate energy control, in direct (but non-wetted) contact with cold (ca. 40° C.) material such as aluminum.

Claims (26)

1. An apparatus for providing a silicon sheet by melting a quantity of silicon comprising:

a plate of material characterized by high thermal conductivity and high reflectivity, defining a containment region sized for holding a quantity of silicon beads in the shape of a desired wafer;

a cover provided over the silicon to form an enclosure enabling introduction of a cover gas;

a source of energy for heating the silicon in the containment region to a molten state;

means for cooling the containment region, such that an interface is provided on the surface of the containment region, in contact with the molten silicon, that prevents wetting, chemical interaction, adhesion and heat transfer with the molten silicon; and

means for controlled cooling of the silicon and for inducing desired crystallization as the silicon is cooled.

2. An apparatus according to claim 1 , wherein the plate defining the containment region comprises aluminum or like material.

3. A process for melting silicon to provide a wafer or sheet of desired dimensions comprising:

providing a containment vessel comprising a plate of material characterized by high thermal conductivity and high reflectivity, sized to contain a quantity of silicon beads in the shape of a desired wafer;

enclosing the containment vessel to admit a cover gas;

heating the silicon to a molten state with a beam of electromagnetic energy, wherein the energy of the beam is chosen from the electromagnetic spectrum, such that the cover is transparent, the silicon is absorbing, and the containment vessel is reflective with respect to the electromagnetic energy;

cooling the containment vessel to prevent wetting of the containment vessel by the silicon;

introducing a seed crystal to induce desired crystallization as the molten silicon is cooled.

4. An apparatus for providing a silicon sheet by melting a quantity of silicon comprising:

a plate of material characterized by high thermal conductivity and high reflectivity, defining a containment region sized for holding a quantity of silicon beads in the shape of a desired wafer;

a cover provided over the silicon to form an enclosure enabling introduction of a cover gas;

a source of energy for heating the silicon in the containment region to a molten state;

means for cooling the containment region, such that a non wetted interface is provided on the surface of the containment region, in contact with the molten silicon, that prevents chemical interaction, with the molten silicon; and

means for controlled cooling of the silicon and for inducing desired crystallization as the silicon is cooled.

5. An apparatus for capacitively melting a quantity of silicon to form a silicon sheet comprising:

first and second conductive plates disposed in parallel, defining a containment region sized for holding a quantity of silicon in the shape of a desired wafer;

means for coupling an alternating current between the plates for heating the silicon in the containment region to a molten state;

means for cooling the containment region, such that a non wetting interface is provided on the surface of the containment region, in contact with the molten silicon, that prevents chemical interaction with the molten silicon; and

means for introducing a seed crystal to the molten silicon for inducing desired crystallization as the silicon is cooled.

6. An apparatus for capacitively melting a quantity of silicon to form a silicon sheet as in claim 5 , wherein the conductive plates are aluminum.

7. An apparatus for capacitively melting a quantity of silicon to form a silicon sheet as in claim 6 further comprising an aluminum oxide layer provided on the surface of the containment region such that a non wetting interface is established between the molten silicon and the surface of the containment region that prevents chemical interaction.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Mar 3, 2014
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC.
Reel/Frame 032382/0724 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2014
From: LAMINAR DIRECT CAPITAL, L.L.C.
To: SOLAICX
Reel/Frame 032327/0693 →
SECURITY AGREEMENT Recorded Feb 28, 2014
From: SUNEDISON, INC.; SUN EDISON LLC; SOLAICX; NVT, LLC; ENFLEX CORPORATION
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 032372/0610 →
RELEASE OF SECURITY INTEREST Recorded Dec 26, 2013
From: GOLDMAN SACHS BANK USA
To: NVT, LLC; SUN EDISON LLC; SOLAICX; SUNEDISON, INC. (F/K/A MEMC ELECTRONIC MATERIALS, INC.)
Reel/Frame 031870/0092 →
SECURITY AGREEMENT Recorded Oct 1, 2012
From: NVT, LLC; SUN EDISON LLC; SOLAICX, INC.; MEMC ELECTRONIC MATERIALS, INC.
To: GOLDMAN SACHS BANK USA
Reel/Frame 029057/0810 →
RELEASE OF SECURITY INTEREST Recorded Mar 31, 2011
From: LAMINAR DIRECT CAPITAL, L.L.C.
To: SOLAICX
Reel/Frame 026053/0355 →
RELEASE OF SECURITY INTEREST Recorded Mar 23, 2011
From: LAMINAR DIRECT CAPITAL, L.L.C.
To: SOLIACX
Reel/Frame 026003/0454 →
GRANT OF PATENT SECURITY INTEREST Recorded Dec 10, 2009
From: SOLAICX
To: LAMINAR DIRECT CAPITAL L.L.C., AS COLLATERAL AGENT
Reel/Frame 023627/0903 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2008
From: GRALENSKI, MARGARET, EXECUTOR ON BEHALF OF NICHOLAS GRALENSKI
To: SOLAICX, INC.
Reel/Frame 021547/0571 →