Patent Assignment
Reel/Frame 016535/0596
Assignment of Assignor's Interest
Recorded: 2005-05-05
Pages: 3
Assignors
OI, KIYOSHI
Executed: 2005-04-13
SHIMIZU, NORIYOSHI
Executed: 2005-04-13
HORIKAWA, YASUYOSHI
Executed: 2005-04-13
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Method of Manufacturing Electronic Part Packaging Structure