Patent Assignment
Reel/Frame 016553/0619
Assignment of Assignor's Interest
Recorded: 2005-05-10
Pages: 3
Assignor
SONG, CHANG HO
Executed: 2005-04-15
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Laser Diode with Thermal Conductive Encapsulating Resin, and Method for Manufacturing the Same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.