Patent Assignment
Reel/Frame 016561/0162
Assignment of Assignor's Interest
Recorded: 2005-07-22
Received: 2005-07-22
Pages: 3
Assignor
NORTH CORPORATION
Executed: 2005-05-31
Assignee
SOCKETSTRATE, INC.
3099 ORCHARD DRIVE, SAN JOSE, CA, 95134, UNITED STATES
Covered Properties
(12)
Interlayer member used for producing multilayer wiring board and method of producing the same
Application:
11/085,108 →
Connecting Member Between Wiring Films, Manufacturing Method Thereof, and Manufacturing Method of Multilayer Wiring Substrate
Application:
11/029,423 →
Multilayer Wiring Board for an Electronic Device
Application:
10/880,588 →
Manufacturing Method for Wiring Circuit Substrate
Application:
10/823,611 →
Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
Application:
10/812,349 →
Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
Application:
10/450,844 →
Connecting Member Between Wiring Films, Manufacturing Method Thereof, and Manufacturing Method of Multilayer Wiring Substrate
Application:
10/358,229 →
Golf Ball
Application:
10/291,482 →
Wiring Circuit Substrate and Manufacturing Method Therefor
Application:
10/287,633 →
Manufacturing Method for Wiring Circuit Substrates
Application:
10/139,237 →
Fabrication Method of Wiring Substrate for Mounting Semiconductor Element and Semiconductor Device
Application:
10/072,351 →
Golf Ball Mold
Application:
09/991,658 →