IP Library Assignment 016583/0654
Patent Assignment
Reel/Frame 016583/0654

Assignment of Assignor's Interest

Recorded: 2004-12-03 Pages: 3
Assignors
KURATA, YASUSHI
Executed: 2004-11-30
KAMIGATA, YASUO
Executed: 2004-11-30
ANZAI, SOU
Executed: 2004-11-30
TERAZAKI, HIROKI
Executed: 2004-11-30
Assignee
HITACHI CHEMICAL CO., LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO 163-0449, JAPAN
Covered Property (1)
Polishing Fluid and Method of Polishing
Patent: 7,799,688 →
Application: 10/517,049 →
Publication: US 2005/0173669
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →