Patent Assignment
Reel/Frame 016589/0662
Assignment of Assignor's Interest
Recorded: 2005-04-28
Pages: 3
Assignors
SUH, DAEWOONG
Executed: 2005-04-19
EITAN, AMRAM
Executed: 2005-04-25
MIN, YONGKI
Executed: 2005-04-21
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Microelectronic Package Interconnect and Method of Fabrication Thereof