Patent Assignment
Reel/Frame 016589/0786
Assignment of Assignor's Interest
Recorded: 2005-05-18
Pages: 5
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Method of Bonding a Microelectronic Die to a Substrate and Arrangement to Carry Out Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.