IP Library Assignment 016606/0921
Patent Assignment
Reel/Frame 016606/0921

Assignment of Assignor's Interest

Recorded: 2005-05-25 Pages: 2
Assignors
HAYASHI, TOSHIYA
Executed: 2005-04-22
TEZUKA, TATSUROU
Executed: 2005-04-22
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA 211-8668, JAPAN
Covered Property (1)
Semiconductor Device with Connecting via and Dummy via and Method of Manufacturing the Same
Patent: 7,417,319 →
Application: 11/136,405 →
Publication: US 2005/0266677
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 11, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025346/0868 →