Patent Assignment
Reel/Frame 016616/0666
Assignment of Assignor's Interest
Recorded: 2005-08-05
Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2005-06-15
LIN, SHIH HSIUNG
Executed: 2005-06-15
LO, HSIN-JUNG
Executed: 2005-06-15
Assignee
MEGIC CORPORATION
21, R&D 1ST RD., SCIENCE-BASED, INDUSTRIAL PARK, HSINCU, R.O.C., TAIWAN
Covered Property
(1)
Process of Bonding Circuitry Components
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 11, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017600/0649 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →