Patent Assignment
Reel/Frame 016663/0263
Assignment of Assignor's Interest
Recorded: 2005-08-24
Pages: 2
Assignors
EDWARDS, DARVIN R.
Executed: 2005-08-19
CHIU, TZ-CHENG
Executed: 2005-07-29
ZENG, KEJUN
Executed: 2005-07-29
Assignee
TEXAS INSTRUMENTS INCORPORATED
P.O. BOX 655474, MS 3999, DALLAS, TEXAS, 75265
Covered Property
(1)
Solder Joints for Copper Metallization Having Reduced Interfacial Voids