Patent Assignment
Reel/Frame 016667/0536
Assignment of Assignor's Interest
Recorded: 2005-06-07
Pages: 4
Assignors
KIM, SOON-BUM
Executed: 2005-05-31
KIM, UNG-KWANG
Executed: 2005-05-31
MA, KEUM-HEE
Executed: 2005-05-31
SONG, YOUNG-HEE
Executed: 2005-05-31
SIM, SUNG-MIN
Executed: 2005-05-31
OH, SE-YONG
Executed: 2005-05-31
LEE, KANG-WOOK
Executed: 2005-05-31
JEONG, SE-YOUNG
Executed: 2005-05-31
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Fabrication Method of Wafer Level Chip Scale Packages