Patent Assignment
Reel/Frame 016679/0241
Assignment of Assignor's Interest
Recorded: 2005-06-09
Pages: 3
Assignors
SAITO, HIDEAKI
Executed: 2005-06-03
HAGIHARA, YASUHIKO
Executed: 2005-06-03
FUKAISHI, MUNEO
Executed: 2005-06-03
MIZUNO, MASAYUKI
Executed: 2005-06-03
IKEDA, HIROAKI
Executed: 2005-06-03
SHIBATA, KAYOKO
Executed: 2005-06-03
Assignees
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO 108-8001, JAPAN
ELPIDA MEMORY INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO 104-0028, JAPAN
Covered Property
(1)
Three-Dimensional Semiconductor Device Provided with Interchip Interconnection Selection Means for Electrically Isolating Interconnections Other Than Selected Interchip Interconnections