IP Library › Assignment 016691/0997
Patent Assignment
Reel/Frame 016691/0997

Assignment of Assignor's Interest

Recorded: 2005-06-15 Pages: 3
Assignor
KIM, DONG JOON
Executed: 2005-03-02
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
1 HYANGJEONG-DONG, HEUNGDUK-GU, CHEONGJU-SI, CHUNGCHONGBUK-DO, KOREA, REPUBLIC OF
Covered Property (1)
Method of Forming Metal Wiring of Semiconductor Device
Patent: 7,220,675 →
Application: 11/089,819 →
Publication: US 2005/0221607
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
After-Acquired Intellectual Property Kun-Pledge Agreement Feb 18, 2009
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL TRUSTEE
Reel/Frame 022277/0133 →
Release of Security Interest Jun 22, 2010
From: U.S. BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 024563/0807 →
Corrective Assignment to Correct the Receiving Party Address Previously Recorded at Reel: 024563 Frame: 0807. Assignor(S) Hereby Confirms the Release by Secured Party. Nov 25, 2014
From: US BANK NATIONAL ASSOCIATION
To: MAGNACHIP SEMICONDUCTOR LTD.
Reel/Frame 034469/0001 →