Patent Assignment
Reel/Frame 016697/0350
Assignment of Assignor's Interest
Recorded: 2005-06-15
Pages: 3
Assignee
LEICA MICROSYSTEMS SEMICONDUCTOR GMBH
ERNST-LEITZ-STRASSE 17-37, WETZLAR, 35578, GERMANY
Covered Property
(1)
Method and system for inspecting a wafer
Application:
11/153,294 →
Publication:
US 2005/0280807
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.